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Offline selective wave soldering machine

Small offline selective wave soldering machine, specially designed for flexible DIP soldering with multi-variety & small-batch production. It supports direct soldering without fixtures, fully solving through-hole component soldering problems.

Keyword:

HSTECH

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  • Technical Parameter
  • Description and Features
  • Application
  • Resolve problems for DIPSoldering

    • Flexible Quick Launch: No custom fixtures required, PCBs can be loaded directly for fast production switching
    • Low Initial Investment: Far lower equipment cost than inline models to reduce upfront capital pressure
    • Ultra-Low Operation & Maintenance Cost: Dramatically reduced consumption of tin dross, flux, electricity and spare parts for long-term cost savings
    • Premium Soldering Performance: 100% tin penetration rate for through holes, soldering yield over 98%
    • Space-Saving Design: Floor area only approx. 1m², ideal for small workshops and lab production lines
    • High Precision Soldering: Original Japanese 0.5mm precision spray nozzle delivers uniform solder joints with few residues and zero missing solder
    • Intelligent Control System: German Siemens PLC + industrial PC, supports offline image programming for easy operation
    • Real-Time Visual Monitoring: Built-in HD camera to monitor wave crest and solder joint forming status in real time

     

    Specification Item SW-320YT Integrated Selective Wave Soldering SW-450YT Integrated Selective Wave Soldering
    Applicable PCB Size L*W: 50×50 ~ 320×250 mm L*W: 50×50 ~ 450×400 mm
    PCB Substrate Requirement Substrate thickness: 0.8~3 mm; Pin length: <3mm Substrate thickness: 0.8~3 mm; Pin length: <3mm
    Component Height Limit Top side of PCB <100mm; Bottom side of PCB <50mm Top side of PCB <100mm; Bottom side of PCB <50mm
    PCB Substrate Conditions 1. Process edge ≥3mm2. Board weight with components <5KG3. Substrate bending <0.5mm 1. Process edge ≥3mm2. Board weight with components <5KG3. Substrate bending <0.5mm
    Tin Furnace Configuration All titanium alloy furnace, 15KG tin capacityTin bath power: 6×300W = 1.8KW All titanium alloy furnace, 15KG tin capacityTin bath power: 6×300W = 1.8KW
    Preheating Power 1KW infrared top preheating 1KW infrared top preheating
    Total Power AC 220V, 3.5KW AC 220V, 3.5KW
    Nitrogen Standard Purity: 99.999%, Air pressure: 0.5MPaConsumption: 20~30L/min (1.2m³/H) Purity: 99.999%, Air pressure: 0.5MPaConsumption: 20~30L/min (1.2m³/H)
    Flux Spray System Original Japan Lumina 0.5mm precision fluid nozzle Original Japan Lumina 0.5mm precision fluid nozzle
    Flux Tank Capacity 2 L 2 L
    Air Source Demand 0.5-0.7Mpa compressed air 0.5-0.7Mpa compressed air
    Customizable Nozzle Inner Diameter φ3mm ~ φ20mm, customizable on demand φ3mm ~ φ20mm, customizable on demand
    Wave Crest Control Automatic alignment + automatic wave height detection & calibration Automatic alignment + automatic wave height detection & calibration
    Control System Industrial PC + Siemens PLC (Windows OS) Industrial PC + Siemens PLC (Windows OS)
    Programming Software Support online & offline PCB image import for graphic programming Visual graphic programming via PCB images, fast & intuitive
    Monitoring Function Real-time video monitoring for full soldering process Real-time video monitoring for full soldering process
    Power Supply Standard Single phase 220V±10%, startup power: 3.5KW Single phase 220V±10%, startup power: 3.5KW
    Machine Weight 120KG (including 15KG solder tin) 150KG (including 15KG solder tin)
    Overall External Dimensions With monitor: 750×950×1350 mmWith top cover: 1000×980×1580 mm With monitor: 880×1280×1350 mmWithout tri-color light: 1270×1280×1580 mm

    Selectives praying (0.5mm precision fluid spray nozzle “Lumina”imported fromJapan with original package)

    Preheating of PCB boardtop

    Preheating of PCB board topOptional

    1KW infrared heating tube preheats PCB top before soldering, meets high-temperature demand of special components, reduces thermal shock, activates flux activity, improves tin penetration of pins and final soldering quality.

    Preheating of PCB board bottom

    Adopts fast heat conduction of infrared ray; continuous heating at set frequency during soldering to prevent PCB temperature drop. Realizes synchronous "preheating + soldering" design, lifts soldering efficiency and tin penetration rate, protects heat-sensitive components and ensures clean PCB surface after welding.

     

    Consumables Introduction

    1. Spray Nozzle Standard outer diameter: 4/6/8/10/12/14mm, customized sizes & irregular nozzles available. Match different solder joints to independently control tin penetration rate and soldering time of each joint.

    2. Nozzle Cleaning Solution XR-901 High temperature easily causes nozzle oxidation, resulting in uneven tin flow. Clean nozzle surface oxide with medical cotton swabs and XR-901 cleaner; 100ml per bottle supports 3 months of regular maintenance.

    3. Nitrogen Gas Inert, non-flammable, non-toxic & eco-friendly. Consumption: 1.2m³/h (20L/min). One 120KG liquid nitrogen tank vaporizes 96m³ gas, supports 1 machine for 8 working days; monthly consumption approx. 3 tanks for 26 working days. Low daily running cost for anti-oxidation soldering.

     

    Whether you are a R&D laboratory developing new electronic products, a small-to-medium electronics assembly factory undertaking multi-variety small-batch DIP orders, or a prototype workshop providing customized circuit board processing services, this offline selective wave soldering machine can perfectly match your production needs.

    Against the current trend of diversified electronics manufacturing, many producers are struggling with the high cost and low flexibility of traditional inline wave soldering when handling non-mass production tasks. Our model eliminates the core pain points of high upfront investment, complicated production changeover and excessive daily consumption that plague small-scale and prototype production. It delivers 98%+ high soldering yield that meets strict mass production quality standards, while retaining the flexibility to switch between different PCB production tasks in minutes, without extra time and cost for custom fixture development.

    It has been widely verified in high-demand soldering scenarios including industrial control circuit boards, automotive electronics components, medical electronic prototypes, and consumer electronics pilot trial production, helping customers effectively balance production efficiency, quality control and long-term operation cost.

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