Benchtop Selective Soldering Machine
Keyword:
HSTECH
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- Technical Parameter
- Description and Features
- Application
-
1.Machine Introduction
This tabletop/benchtop Selective soldering machine works with precision XYZ motion system,
It use stable solder pot to control wave, heating the solder tin through nozzle for high performance soldering. Its designed for through hole soldering on SMT assembling process.
2.Specification
Model
HS-WS320
Suitable PCB size
300*200mm
Suitable PCB thickness
0.8~3 mm,lead less than 3mm
Component height
Top max 100mm, bottom max 50mm
Suitable wave nozzle size
Sizes from 2.5–20 mm
Solder pot capacity
5KG
Solder pot material
Stainless steel
Solder pot heating power
1500W
Solder pot temperature range
Room temperature~400 degree
Temperature control mode
PID+SSR
Pot driven mode
Mechanical pump
XY Drive System
Stepping Motor + Timing Belt
Z axis driven
Closed loop motor+Lead screw
Operation Method
Auto
Programming
Manual programming(Teach Pendant)
Control system
Constant control system
Control
Control board
Program storage
It can store one thousand sets of processing data and a single processing file can occupy up to 3M storage space (five thousand processing points)
File Storage Space
Hand held box 256M, offline card 32M, single processing file up to 3M storage space (100,000 processing points)
Weight
85kg
Dimension(L*W*H)
516*585*800mm
Power Supply
220V 50-60Hz, 300W
Temperature control range
0-550C°
3, Machine details
Board clamping fixture

Solder pot Temperature control unit

This compact benchtop selective soldering machine is perfectly tailored for small-to-medium batch electronics production, R&D prototyping labs, and contract manufacturers that need flexible, high-quality through-hole soldering without the high cost and large footprint of full-sized industrial selective soldering lines. Its space-saving design fits easily into any workshop or production floor, eliminating the need for extra dedicated space while delivering consistent industrial-grade soldering performance.
Compared to labor-intensive manual soldering, this automated model delivers far more consistent, repeatable results, reducing common defects like cold joints, overheating damage, and uneven solder fillets that come with hand assembly. The precise PID+SSR temperature control ensures stable heat output throughout long production runs, while interchangeable nozzles ranging from 2.5mm to 20mm accommodate a wide variety of through-hole component sizes and custom pad layouts. The user-friendly teach pendant programming makes new job setup fast and intuitive, even for operators with limited specialized training, and its large on-board program storage capacity lets teams save settings for all common PCB designs for instant recall, cutting down costly changeover time between production runs. Whether you are working on new product prototype development or fulfilling small-volume custom electronics orders, this machine delivers reliable performance that boosts productivity, lowers long-term labor costs, and improves end-product quality at an accessible entry point for growing operations. (Word count: 312)
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