What advantages will the combined use of SPI and AOI bring


Release time:

2022-02-08

With the development of modern high-tech, the detection technology of SMT products is also constantly updated. Various detection equipments have emerged one after another in the human eye with magnifying glass or microscope.

With the development of modern high-tech, the detection technology of SMT products is also constantly updated. Various detection equipments have emerged one after another in the human eye with magnifying glass or microscope. The higher the volume, the smaller the volume - 01005 or even smaller, which is far from enough for human visual inspection ability, and the AOI automatic optical inspection equipment is updated and has become more efficient! Therefore, with the development of the PCBA industry, the stronger the function and the smaller the volume, the AOI will show its important position more and more!

SMT Line SPI AOI Buffer

With the help of AOI, and then human visual inspection, the following components cannot be visually inspected, and AOI buffer inspection can be used to re-visualize false positives. Of course, it is good to be able to use online AOI + offline AOI, but it is only a PCB circuit board with small components, and ICT has no place to place a needle. At this time, the solder paste detector with 3D raster scanning can automatically and truly realize the automatic judgment of the correlation between measurement data and product lines, stencils and printing parameters, and automatically generate reports. The benefits brought by the introduction of SPI The advantages brought by the online 3D solder paste inspection equipment.

(1) According to statistics, the introduction of SPI can effectively reduce the unqualified rate of the original finished PCB by more than 85%; the cost of repair and scrap is greatly reduced by more than 90%, and the quality of the factory products is significantly improved.

(2) The combined use of SPI and AOI, through real-time feedback and optimization of the SMT production line, can make the production quality more stable, greatly shorten the unstable trial production stage that must be experienced when new products are introduced, and save the corresponding cost.

(3) It can greatly reduce the misjudgment rate of AOI about soldering, thereby improving the pass-through rate and effectively saving the manpower and time cost of manual error correction. According to statistics, 74% of the unqualified parts of the current finished PCB are directly related to solder, and 13% are indirectly related. SPI effectively makes up for the shortcomings of traditional detection methods through 3D detection methods.

(4) Some components on the PCB, such as BGA, CSP, PLCC chips, etc., are blocked by light due to their own characteristics, and AOI cannot detect them after SMD reflow. And SPI, through process control, minimizes the bad conditions of these devices after the furnace.

(5) With the increasing precision of electronic products and the trend of lead-free soldering, SMD components are getting smaller and smaller. Therefore, the quality of solder paste printing is becoming more and more important. SPI can effectively ensure good solder paste printing quality and greatly reduce the possible defective rate of finished products.