Publish Date: Sep 07, 2026

SHENZHEN, China — HSTECH has launched the HS‑D5331, a table‑top two‑component epoxy and coating dispensing machine, also known as an AB glue dispenser, designed to replace inconsistent manual dispensing operations for electronics and general manufacturing industries.

This single‑head dual‑platform dispensing system adopts X/Y1/Y2/Z multi‑axis structure driven by stepping motors and timing belts. It achieves high repeat positioning accuracy of ±0.01 mm, with maximum moving speed up to 300 mm/s. Dispensing precision reaches ±1 % for glue volume and ±1 % for AB mixing ratio, which effectively eliminates defects caused by manual glue mixing and dispensing.

The machine is equipped with separate tanks for A glue and B glue. Users can set custom mixing ratios according to adhesive requirements. Program creation is completed via teach pendant; up to 100 groups of programs can be stored on CF card, and each program supports up to 4000 motion points. It supports versatile dispensing patterns including dots, lines, circles, arcs, continuous paths and 3‑D linear interpolation for complex workpiece surfaces such as vertical planes, gaps and spherical surfaces.

Weighing 45 kg with dimension 630×620×610 mm, the HS‑D5331 works under AC 110‑220V wide‑range power supply. The system features trapezoidal acceleration‑deceleration control and high‑speed low‑noise Japanese stepping motors for stable long‑hour running. Optional upgrades include custom fixtures, glue guns and heating temperature control modules to match diverse production needs.

Widely applied for sensors, relays, power adapters, PCB bonding, COB & IC packaging, speaker components, mobile‑phone battery sealing, hardware encapsulation and automotive mechanical part coating, this automatic dispensing equipment helps manufacturers boost throughput and cut production costs compared with traditional manual workflows.

“Many factories still struggle with uneven glue output and unstable mixing ratios from manual AB glue handling,” commented our product specialist. “HS‑D5331 delivers repeatable dispensing quality while keeping operation intuitive for shop‑floor operators.”

Prospective clients may contact our sales team to obtain datasheets, technical parameters and quotation for the HS‑D5331 two‑component dispensing solution.

As a leading developer of fluid dispensing automation solutions serving Asian and global manufacturing markets, HSTECH designed the compact HS-D5331 specifically to fill the gap between low-precision entry-level dispensers and costly large-format inline dispensing systems, making high-precision AB glue application accessible to small and medium-sized production facilities as well as large-scale enterprise manufacturers.

Prior to full mass production, the machine completed 6 months of continuous on-site trial testing with 12 electronics and automotive component manufacturers across the Pearl River Delta. Trial data collected from these partners shows an average 75% reduction in excess glue material waste, a 2.8x increase in production throughput for small-to-medium batch runs, and a 17 percentage point improvement in first-pass product yield compared to traditional manual dispensing workflows. Unlike many imported high-precision dispensing alternatives that require complex facility modifications, the table-top footprint of the HS-D5331 fits easily into existing workshop layouts without major infrastructure overhauls, lowering the barrier for factories looking to upgrade their adhesive processing.

HSTECH also provides global clients with responsive after-sales support, including free remote programming training, a 12-month full warranty for all core electrical and motion components, and fast spare parts delivery for North American, European, and Southeast Asian customers. The company will showcase the HS-D5331 at the 2026 Shanghai International Industrial Automation Exhibition this October, where attendees can view live dispensing demonstrations and request custom trials matching their specific adhesive and workpiece requirements. (Word count: 318)