Glue Dispensing Machine
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HSTECH
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- Technical Parameter
- Description and Features
- Application
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Specification
ITEM SPEC Model HS-D331-A Glue Mixing Ratio 1:1-10:1/Customizable Dispensing Speed 10-150g/5s(based on 1:1 glue proportion) Dispensing Precision Glue Amount±1%, Glue Proportion±1% X/Y/Z Working Range 300*300*100mm(Z axis can be rotated) XYZ Speed Max 300mm/s Drive System Stepping Motor + Timing Belt Repeatability ±0.02mm Pattern Lines, Circles, Arcs, Continuous Paths, 3D Linear Interpolation Potting Precision Amount±1%, Ratio:±1% Operation Method Auto Programming Teach Pendant Control Board card Leak-proof Function Valve with Vacuum Device Weight 65kg Dimension(L*W*H) 716*585*645mm Power Supply 220V 50-60Hz 350W Machine feature
1. Manual programming operation, easy to program, easy to learn and understand.
2. It has the functions of drawing points, lines, faces, arcs, circles, and continually tween of irregular curves to realize any 3D non-planar track path.
3. The volume of the glue, the speed of the glue, the time of dispensing, and the time of stopping the glue can all be programmed.
4. With the special dispensing controller, the glue output is stable, the glue is clean and the glue is not leaked.
5. Quickly dot, draw lines and draw circles in the inner, outer wall, vertical surface, gap and spherical surface of the product.
6. According to the needs of customers, it can be equipped with fixtures, glue guns, controllers, heating temperature control devices, etc.
Applications
This equipment is suitable for high efficiency, high running precision and production process of dispensing. Generally suitable for products with sensors, relays, power adapters, electronic toys, sounders, electronic components, household appliances, electric vehicle controllers, computer digital products, crafts, mobile phone boards, coil products, button products,battery boxes, speakers Dot glue bonding; speaker packaging and dispensing, optical semiconductor, mobile phone battery, laptop battery packaging, PCB board bonding, COB, IC, PDA, LCD sealing, IC packaging, IC bonding, chassis bonding, Optical device processing, hardware parts package coating, quantitative liquid filling, chip bonding, automotive mechanical parts coating,mechanical seals, etc.
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CONTACT US
SHENZHEN HANSOME TECHNOLOGY CO.,LTD.
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
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