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Mobile Phone BGA Rework Station(HS-700)

Machine Introduction 1. 5 work modes 2. 15''HD LCD monitor 3. 7''HD color touch screen 4. stepping motor 5. CCD color optical alignment system 6.Temperature accuracy within ±1℃ 7.Mounting precision within ±0.01mm 8.Repair success rate: 99% + 9. Independent research and development of single-chip control

Keyword:

HSTECH

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  • Description
  • Machine Introduction

    1. 5 work modes

    2. 15''HD LCD monitor

    3. 7''HD color touch screen

    4. stepping motor

    5. CCD color optical alignment system

    6.Temperature accuracy within ±1℃

    7.Mounting precision within ±0.01mm

    8.Repair success rate: 99% +

    9. Independent research and development of single-chip control
     

    Specification

    Mobile Phone BGA Rework Station Model:HS-700
    Power Supply AC 100V / 220V±10% 50/60Hz
    Total power 2600W
    Heater power Top heater 1200W(Max), bottom heater 1200W(Max)
    Electric material Driving motor + smart temp. controller + color touch screen
    Temperature control high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃)
    Sensor 1pcs
    Locating way V shape PCB support + external universal fixture + laser light for centering and positioning
    Overall dimension L450mm*W470mm*H670mm
    PCB size Max 140mm*160mm   Min 5mm*5mm
    BGA size  Max 50mm*50mm   Min 1mm*1mm
    Applicable PCB thickness 0.3 - 5mm
    Mounting accuracy ±0.01mm
    Weight of machine 30KG
    Mount chip weight 150g
    Working modes Five: Semi-auto/Manual/Remove/Mount/Weld
    Usage Repair chips / phone motherboard etc 
    Keywords:
    • Mobile Phone BGA Rework Station

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