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Mobile Phone BGA Rework Station(HS-700)
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Number of views:
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PRODUCTS
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Parameters
Machine Introduction
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
Specification
Mobile Phone BGA Rework Station | Model:HS-700 |
Power Supply | AC 100V / 220V±10% 50/60Hz |
Total power | 2600W |
Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
Electric material | Driving motor + smart temp. controller + color touch screen |
Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
Sensor | 1pcs |
Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
Overall dimension | L450mm*W470mm*H670mm |
PCB size | Max 140mm*160mm Min 5mm*5mm |
BGA size | Max 50mm*50mm Min 1mm*1mm |
Applicable PCB thickness | 0.3 - 5mm |
Mounting accuracy | ±0.01mm |
Weight of machine | 30KG |
Mount chip weight | 150g |
Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
Usage Repair | chips / phone motherboard etc |
Keyword:
Mobile Phone BGA Rework Station
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