Mobile Phone BGA Rework Station(HS-700)

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Mobile Phone BGA Rework Station(HS-700)
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Mobile Phone BGA Rework Station(HS-700)

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Category: BGA Rework Station
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Parameters

Machine Introduction

1. 5 work modes

2. 15''HD LCD monitor

3. 7''HD color touch screen

4. stepping motor

5. CCD color optical alignment system

6.Temperature accuracy within ±1℃

7.Mounting precision within ±0.01mm

8.Repair success rate: 99% +

9. Independent research and development of single-chip control
 

Specification

Mobile Phone BGA Rework Station Model:HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total power 2600W
Heater power Top heater 1200W(Max), bottom heater 1200W(Max)
Electric material Driving motor + smart temp. controller + color touch screen
Temperature control high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃)
Sensor 1pcs
Locating way V shape PCB support + external universal fixture + laser light for centering and positioning
Overall dimension L450mm*W470mm*H670mm
PCB size Max 140mm*160mm   Min 5mm*5mm
BGA size  Max 50mm*50mm   Min 1mm*1mm
Applicable PCB thickness 0.3 - 5mm
Mounting accuracy ±0.01mm
Weight of machine 30KG
Mount chip weight 150g
Working modes Five: Semi-auto/Manual/Remove/Mount/Weld
Usage Repair chips / phone motherboard etc 
Keyword:
Mobile Phone BGA Rework Station
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CONTACT US

SHENZHEN HANSOME TECHNOLOGY CO.,LTD.

3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China 

Mob/WhatsApp: 86-18825230535 (24hrs)

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