Mobile Phone BGA Rework Station(HS-700)
Keyword:
HSTECH
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- Description
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Machine Introduction
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
Specification
Mobile Phone BGA Rework Station Model:HS-700 Power Supply AC 100V / 220V±10% 50/60Hz Total power 2600W Heater power Top heater 1200W(Max), bottom heater 1200W(Max) Electric material Driving motor + smart temp. controller + color touch screen Temperature control high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) Sensor 1pcs Locating way V shape PCB support + external universal fixture + laser light for centering and positioning Overall dimension L450mm*W470mm*H670mm PCB size Max 140mm*160mm Min 5mm*5mm BGA size Max 50mm*50mm Min 1mm*1mm Applicable PCB thickness 0.3 - 5mm Mounting accuracy ±0.01mm Weight of machine 30KG Mount chip weight 150g Working modes Five: Semi-auto/Manual/Remove/Mount/Weld Usage Repair chips / phone motherboard etc Keywords:- Mobile Phone BGA Rework Station
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CONTACT US
SHENZHEN HANSOME TECHNOLOGY CO.,LTD.
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
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