Manual BGA Rework Station(HS-520)
Machine Introduction
1.Repair Success Rate:More Than 99%
2. Using The Industrial Touch Screen
3.Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat. (temperature accuracy ± 2℃)
4.With CE Certification
Keyword:
HSTECH
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- Description
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Machine Introduction
1.Repair Success Rate:More Than 99%
2. Using The Industrial Touch Screen
3.Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat. (temperature accuracy ± 2℃)
4.With CE Certification
Specification
Manual BGA Rework Station Model:HS-520 Power Supply AC 220V±10% 50/60Hz Total power 3800W Overall dimension L460mm*W480mm*H500mm PCB size Max 300mm*280mm Min 10mm*10mm BGA size Max 60mm*60mm Min 1mm*1mm PCB thickness 0.3-5mm Weight of machine 20KG Warranty 3 years (1st year is free) Usage Repair chips / phone motherboard etc Keywords:- BGA Rework Station
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CONTACT US
SHENZHEN HANSOME TECHNOLOGY CO.,LTD.
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
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