Manual BGA Rework Station(HS-520)

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Manual BGA Rework Station(HS-520)
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Manual BGA Rework Station(HS-520)

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Category: BGA Rework Station
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Parameters

 Machine Introduction

1.Repair Success Rate:More Than 99%

2. Using The Industrial Touch Screen

3.Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat. (temperature accuracy ± 2℃)

4.With CE Certification

Specification 

Manual BGA Rework Station Model:HS-520
Power  Supply AC 220V±10% 50/60Hz
Total power 3800W
Overall dimension L460mm*W480mm*H500mm
PCB size Max 300mm*280mm   Min 10mm*10mm
BGA size  Max 60mm*60mm   Min 1mm*1mm
PCB thickness 0.3-5mm
Weight of machine 20KG
Warranty 3 years (1st year is free)
Usage Repair chips / phone motherboard etc

 

Keyword:
BGA Rework Station
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CONTACT US

SHENZHEN HANSOME TECHNOLOGY CO.,LTD.

3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China 

Mob/WhatsApp: 86-18825230535 (24hrs)

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