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BGA Rework Station(HS-620)

Machine Introduction 1.Automatic&Manual operation system. 2. 5 million CCD camera optical alignment system mount precision:±0.01mm. 3.MCGS touch screen control. 4.Laser position. 5.Repair success rate 99.99%

Keyword:

HSTECH

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  • Description
  • Machine Introduction

    1.Automatic&Manual operation system.

    2. 5 million CCD camera optical alignment system mount precision:±0.01mm.

    3.MCGS touch screen control.

    4.Laser position.

    5.Repair success rate 99.99%

    Specification

    BGA Rework Station Model:HS-620
    Power Supply AC 220V±10% 50/60Hz
    Total power 3500W
    Heater power Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W
    Electric material Driving motor+PLC smart temp.controller+color touch screen
    Temperature control independent temp.controller,the precision can reach ±1℃
    Temperature Interface 1pcs
    Locating way V shape slot,PCB support jigs can adjust,laser light do fast centering and position
    Overall dimension L650mm*W630mm*H850mm
    PCB size Max 450mm*390mm   Min 10mm*10mm
    BGA size  Max 80mm*80mm   Min 1mm*1mm
    Weight of machine 60KG
    Usage Repair chips / phone motherboard etc 
    Keywords:
    • BGA Rework Station

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