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BGA Rework Station(HS-620)
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Number of views:
1000
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PRODUCTS
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Parameters
Machine Introduction
1.Automatic&Manual operation system.
2. 5 million CCD camera optical alignment system mount precision:±0.01mm.
3.MCGS touch screen control.
4.Laser position.
5.Repair success rate 99.99%
Specification
BGA Rework Station | Model:HS-620 |
Power Supply | AC 220V±10% 50/60Hz |
Total power | 3500W |
Heater power | Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W |
Electric material | Driving motor+PLC smart temp.controller+color touch screen |
Temperature | control independent temp.controller,the precision can reach ±1℃ |
Temperature Interface | 1pcs |
Locating way | V shape slot,PCB support jigs can adjust,laser light do fast centering and position |
Overall dimension | L650mm*W630mm*H850mm |
PCB size | Max 450mm*390mm Min 10mm*10mm |
BGA size | Max 80mm*80mm Min 1mm*1mm |
Weight of machine | 60KG |
Usage Repair | chips / phone motherboard etc |
Keyword:
BGA Rework Station
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SHENZHEN HANSOME TECHNOLOGY CO.,LTD.
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
E-mai: sales@hstech-smt.com
Tel: 86-755-23209382
Mob/WhatsApp: 86-18825230535 (24hrs)
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