BGA Rework Station(HS-620)
Machine Introduction
1.Automatic&Manual operation system.
2. 5 million CCD camera optical alignment system mount precision:±0.01mm.
3.MCGS touch screen control.
4.Laser position.
5.Repair success rate 99.99%
Keyword:
HSTECH
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- Description
-
Machine Introduction
1.Automatic&Manual operation system.
2. 5 million CCD camera optical alignment system mount precision:±0.01mm.
3.MCGS touch screen control.
4.Laser position.
5.Repair success rate 99.99%
Specification
BGA Rework Station Model:HS-620 Power Supply AC 220V±10% 50/60Hz Total power 3500W Heater power Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W Electric material Driving motor+PLC smart temp.controller+color touch screen Temperature control independent temp.controller,the precision can reach ±1℃ Temperature Interface 1pcs Locating way V shape slot,PCB support jigs can adjust，laser light do fast centering and position Overall dimension L650mm*W630mm*H850mm PCB size Max 450mm*390mm Min 10mm*10mm BGA size Max 80mm*80mm Min 1mm*1mm Weight of machine 60KG Usage Repair chips / phone motherboard etc Keywords:- BGA Rework Station
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CONTACT US
SHENZHEN HANSOME TECHNOLOGY CO.,LTD.
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
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