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The choice of using SMT Nozzle Cleaner to remove residues after SMT patch processing
SMT Nozzle Cleaner is mainly used for post-soldering cleaning of assembled boards during SMT chip processing to remove flux residues after wave soldering, reflow soldering and manual soldering, as well as contaminants caused by the assembly process.
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What is the difference between SPI and AOI buffer in SMT process
The main difference between SPI and AOI buffer in the SMT process is: SMT buffer is the quality inspection of solder printing, through the inspection data to debug, verify and control the solder paste printing process; while AOI buffer is divided into two types: before and after the furnace.
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Classification of PCB shuttle conveyor
The single-track PCB shuttle conveyor transports one PCB at a time. When a PCB board is mounted, the next PCB board is already in the buffer area, and the width of the PCB board can be automatically adjusted according to the programmed PCB board parameters.
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Structure and composition of PCB shuttle conveyor
The PCB shuttle conveyor integrates modular stand-alone devices and is truly independent of other modules in the system. PCB shuttle conveyor is equipped with a thin and narrow belt on the track.
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SMT cooling conveyor processing flow and matters needing attention
Solder paste printing: Its function is to print the solder-free paste on the PCB pads to prepare for the soldering of components. The equipment used is a screen printing machine, located at the forefront of the SMT cooling conveyor production line.
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