The choice of using SMT Nozzle Cleaner to remove residues after SMT patch processing


Release time:

2021-11-29

SMT Nozzle Cleaner is mainly used for post-soldering cleaning of assembled boards during SMT chip processing to remove flux residues after wave soldering, reflow soldering and manual soldering, as well as contaminants caused by the assembly process.

SMT Nozzle Cleaner is mainly used for post-soldering cleaning of assembled boards during SMT chip processing to remove flux residues after wave soldering, reflow soldering and manual soldering, as well as contaminants caused by the assembly process.

SMT nozzle cleaner

SMT Nozzle Cleaner selection requirements

1. It has a strong ability to dissolve pollutants, can effectively dissolve and remove cutin, without leaving stains and scars;
2. No corrosion of components and equipment, simple operation;
3. Non-toxic and low-toxic;
4. Non-flammable, non-explosive, stable physical and chemical properties;
5. Low price, small consumption and easy to recycle;
6. The surface tension is low, which is beneficial to penetrate the narrow gap between the components and the substrate and improve the cleaning efficiency;
7. It is harmless to the environment, and finally choose non-ODS solvents.