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  • HS-PF-PUR30CC.jpg
  • HS-PF-PUR300CC-A.jpg
  • HS-PF-PUR300CC-B.jpg
  • 图片2(1699089297416).jpg

PUR Jetting Valve HS-PF-PUR30CC

Keyword:

HSTECH

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  • Description
  • Principle & Control

    30CC PUR Jetting Valve
    1.The PUR injection valve consists of a drum heating module, a pressurized cap module, a nozzle heating module, a flow path module, a valve body module and a heat dissipation module.

    2.The barrel heating module carries the barrel as well as the one-stage heating with controllable temperature. The initial heating of the gel is completed.

    3.The pressurized cap module seals and pressurizes the drum and controls the output pressure through the controller.

    4.The heat dissipation module dissipates heat and reduces noise from the valve body.

    5.The piezoelectric injection valve adopts a modular design, the part in contact with the gel is designed as the runner module, and the part not in contact with the gel is designed as the valve body module.

    6. The flow path module can be changed to meet the dispensing requirements in different applications.

    7.Nozzle diameters in series (from 40µm to 500µm).

    8.The nozzles are categorized into flat jet type, needle type, and extension type.

    9.Runner modules need to be cleaned regularly in an ultrasonic cleaner. Seals must not be immersed in organic solvents. Special tools are required to clean the nozzles to prevent damage to the nozzles.

     

    Jet Valve Controller
    1. The touch screen controls the piezoelectric injection valve and dispensing system, supports MES communication, powerful, safe and reliable.
    2. The touch screen adopts graphic control mode, the components of dispensing system and the control display function are displayed graphically, which is concise and intuitive.
    3.Nozzle heating device: The nozzle is required to be heated to a suitable temperature before dispensing. The heating device adopts one-stage heating mode.
    4.Heating at the nozzle maintains the constant temperature of the gel to meet the best performance of the gel. The best performance of the colloid.

     

    Nozzle and barrel heating

    1.The nozzle is required to be heated to a suitable temperature before dispensing. The heating device adopts two-stage heating mode.
    2.Heating at the nozzle maintains the constant temperature of the gel to meet the best performance of the gel. The best performance of the colloid.

     

    Specification

    Model

    HS-PF-PUR30CC

    HS-PF-PUR300CC-A/B

    Size (L*W*H)

    116MM*96MM*218MM

    116MM*96MM*218MM

    Weight

    About 1.2kg

    About 1.5kg

    Material of heat insulation block

    PEEK

    PEEK

    Temperature measuring method

    PT100

    PT100

    Barrel Heating temperature

    ≤150℃

    ≤160℃

    Syringe air pressure

    0~2.0Kpa

    0~2.0Kpa

    Glue dispensing precision

    98%

    98%

    Minimum glue line width

    0.35MM

    0.5MM

    Viscosity range

    1~100000Cps

    1~100000Cps

    Jet speed

    200 points/sec

    200 points/sec

    Valve material

    Super Hard Stainless Steel

    Super Hard Stainless Steel

    Nozzle material

    Tungsten Steel

    Tungsten Steel

    Heating voltage

    220V

    220V

    Seat heating temperature

    ≤250℃

    ≤250℃

    Valve air pressure

    6.5~7.0Kpa

    6.0~7.0Kpa

    Glue Dispensing Volume

    0.3nl

    0.3nl

    Diameter of the most glue dispensing

    0.3MM

    0.4MM

    Power source

    Dry compressed gas

    Dry compressed gas

    Applicable liquid

    PUR hot melt adhesive, silicone products, epoxy resin, etc.

    Most hot melt adhesives, silicone, red glue, epoxy resin, black glue, etc.

     

    Advantages

    1.The barrel heating is suitable for 30cc, 100cc, 300cc hot melt adhesive with different volume.
    2. Modularized design, easy to replace parts, simple debugging, wide range of process applications.
    3. Spray volume can be accurate to 0.3nL, spray adhesive spot consistency accuracy of up to 98%.
    4. Minimum 0.17mm line width, minimum 0.15mm spot diameters of hot melt glue spraying process can be realized.
    5. Can match any motion platform on the market.

     

    Application Field

    SMT/FPC/PCB,Assembly, flat panel display assembly, semiconductor packaging, LED industry, medical equipment industry,Non-marking lingerie industry.

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