Jetting Valve HS-PF-100 HS-PF-200
Keyword:
HSTECH
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- Description
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Principle & Control
Contactless Pneumatic Jet Valves
1.High-speed jet valve is a high speed non-contact jet valve driven by pneumatic pressure and controlled by solenoid valve, breaking through the traditional contact dispensing technology, no need to move the Z-axis when working, the spring pressure in the cavity is adjustable pneumatic pressure is used to drive, non-contact jet dispensing, high precision, fast speed solenoid valve control, fine scale micrometer to adjust the stroke, the spring pressure in the cavity is adjustable air-cooled way of physical cooling and cooling of the valve, which greatly improves the performance and life of the valve. Improve the performance and life of the valve.
2.Compact exterior design, flexible equipment installation, fast maintenance and servicing.
Jet Valve Controller
1. The touch screen controls the piezoelectric injection valve and dispensing system, supports 485 communication, powerful, safe and reliable.
2. The touch screen adopts graphic control mode, the components of dispensing system and the control display function are displayed graphically, which is concise and intuitive.
3.Nozzle heating device:The nozzle is required to be heated to a suitable temperature before dispensing. The heating device adopts one-stage heating mode.
4.Heating at the nozzle maintains the constant temperature of the gel to meet the best performance of the gel. The best performance of the colloid.Specification
Model
HS-PF-100/200
Drive Voltage
24V
Minimum Drive Air Voltage
0.6-0.8mPa (90Psi)
Barrel Air Pressure
0-0.4mPa (50Psi)
Valve Body Material
Aluminum
Fluid groove material
SUS304
Piston seal
PTFE synthetic material
Needle Seal
PEK/PTFE/PE optional
Needle Material
Super Carbide
Nozzle Material
Super Carbide
Body Temperature
≤100℃
Nozzle Temperature
Room temperature~130°C
Dimension
24×90×160mm
Body weight
0.55kg
Applicable liquid
High-speed and controlled volume dispensing of a wide range of fluids and adhesives, such as bottom filler, UV adhesive, silver paste, silicone, epoxy adhesive, surface coating adhesive, surface mount adhesive and so on.
Application Field
Camera Module Bonding, Sensor Control Unit Bonding and Potting, Flexible Board Bonding, Main Board Underfill, Bezel Bonding, Fingerprint Key Module Bonding, Sensor Control Unit Bonding, Power Supply Potting.
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