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BGA Rework Station(HS-800)

1.Hot air head and mounting head integration design, with auto soldering and desoldering functions. 2.Upper heaters adopt hot air system, heating faster, temperature evenness, cooling faster. (the temperature can be up to 50 to 80 centigrade). 3.Independent 3 heaters. upper and lower heaters can realize move synchronously and automatically, can reach IR every position. Lower heater zone can remove up and down, support

Keyword:

HSTECH

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  • Description
  • Machine Introduction

    1.Hot air head and mounting head integration design, with auto soldering and desoldering functions.
    2.Upper heaters adopt hot air system, heating faster, temperature evenness, cooling faster. (the temperature can be up to 50 to 80 centigrade).
    3.Independent 3 heaters. upper and lower heaters can realize move synchronously and automatically, can reach IR every position. Lower heater zone can remove up and down, support PCB board.
    4.PCB board adopts high accuracy slider to make sure the mount precision of BGA and PCB.
    5.Unique bottom preheating table made of Germany-imported good quality heating materials plated.
    6.Preheating table, clamping device and cooling system can move integrally in X axis that make PCB locating & desoldering safer and conveniently.
    7.X and Y axis adopt motor automatic control moving way to make the alignment faster and more convenient.
    8. Double rocker control the camera and upper and lower heating platform to make sure the alignment precision accuracy.
    9.Inbuilt vacuum pump, rotate 360 in angel; fine-adjusting mounting suction nozzle.
    10.Suction nozzle can detect BGA pickup and mounting height automatically with pressure controllable within 10 grams; zero pressure available to smaller BGA pickup and mounting.
    11.Color high-resolution optical vision system, movable by hand in X/Y axis, with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom; reworkable max. BGA size 80*80MM;
    12.With 10 segments of temperature up (down) and 10 segments of constant temperature control, can save many segments of temperature.
    13.Many sizes of alloy nozzle, easy for replacement; can locate at all angle.
    14.With 5 thermocouple ports, can real-time detect and analyze temperatures at multipoint.
    15.With a solid operation display function to make the temperature control more reliable.

    Specification

    BGA Rework Station Model:HS-800
    Heater power Top heater 1200W(Max), bottom heater 1200W(Max)
    Bottom Pre-Heating IR 5000w
    Temperature control K-type thermocouple,close loop control
    Locating way Outer or location hole
    Overall dimension L970mm*W700mm*H830mm
    PCB size W650*D610mm
    BGA size Max 80mm*80mm   Min 1mm*1mm
    Applicable PCB thickness 0.3 - 5mm
    Mounting accuracy ±0.01mm
    Weight of machine 140KG

     

    Keywords:
    • BGA Rework Station

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